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Copper sinter pastes for high power and optoelectronics packaging
Copper sinter pastes for high power and optoelectronics packaging
Under the “Cuprum” series we launched the world‘s first copper sinter paste designed and made in Germany. Cuprum is suitable for a wide range of applications ranging from laser diodes and high-power LEDs in optoelectronics packaging, Si and SiC devices for high power electronics and specialized solutions for battery applications.
The Cuprum series has class-leading features for die attach and large area bonding:
Low cost → substantial cost advantage compared to Ag sinter pastes. Compatible with existing industrialized Ag sintering processes and equipment.
Rapid Sintering Process → fast pre-drying of just 5 min. and rapid sintering (3-5 min.) for all metallization (Ag, Au, Cu)
High Thermal Conductivity (> 220 W/mK) → optimal performance for die-attach and substrate attach applications
Formulations enabling sintering in open bond chamber under nitrogen → flexibility & cost savings (equipment & process)
Environmentally friendly binders and metal particles → No nanoparticles
Storage @ room temperature for 6 months
Low sintering temperature (≤ 275°) → reduced wear on substrates & components
Low bonding pressure (≤ 20 MPa) → reduced wear and damage of chips
Suitable for standard metallizations (e.g. Au, Ag, Cu, Pd) → flexibility
Flexibility on die size for die-attach applications → 0.5 mm2 to 100 mm2
Easy clean paste after stencil/screen printing → No residues after sintering
No nanoparticles or harmful organics in the paste formulation → Reduced health hazard to operators.
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